Erfahrungsberichte

MESSEN UND EVENTS

WorkXPlore 3D und andere Sescoi-Lösungen werden regelmäßig bei Arbeitstreffen, Seminaren oder Messen in Ihrer Nähe rund um die Welt gezeigt.

Sie finden nachstehend eine Liste der nächsten Events

	Salon de l'INDUSTRIE et de la sous-traitance, Nantes, France, 16th-18th March
	DieMould India 2010, Mumbai 18th-21st March 2010
	INDUSTRIE 2010, Paris, France, 22-26 March 2010
	EuroStampi, Parma Fairground, Italy 25th-27th March 2010
	SIMTOS, Kintex Exhibiton Centre, Goyang, Korea 13th - 18th April 2010
	Intermold, Intex, Osaka, Japan 14th - 17th April 2010
	MEDTEC 2010, Besançon, France, 21-22 April 2010
	Die & Mould China 2010, Shanghai, 11-15 May 2010
	Rosmould, Moscow. Russia. 2 - 4 June 2010
	DMS, Tokyo Big Sight, Tokyo, Japan 23rd - 25th July 2010
	IMTS, Chicago illinois, 13-18 September 2010
	Alihankinta 2010, Tampere Exhib and Sports Centre, Finland. 21st - 23rd September 2010
	MICRONORA 2010, Besançon, France, 28 September - 1 October 2010
	JIMTOF, Tokyo Big Sight, Tokyo, Japan 28 October - 2nd November 2010
	Metalex, BITEC, Bangkok, Thailand 24 - 27 November 2010